Millimeter-Wave Integrated Circuits delivers a detailed overview of MMIC design, specifically focusing on designs for the millimeter-wave (mm-wave) frequency range. The scope of the book is broad, spanning detailed discussions of high-frequency materials and technologies, high-frequency devices, and the design of high-frequency circuits. The design material is supplemented as appropriate by theoretical analyses. The broad scope of the book gives the reader a good theoretical and practical understanding of mm-wave circuit design. It is best-suited for both undergraduate students who are reading or studying high frequency circuit design and postgraduate students who are specializing in the mm-wave field.
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
This book addresses in-depth technical issues, limitations, considerations and challenges facing millimeter-wave (MMW) integrated circuit and system designers in designing MMW wireless communication systems from the complementary metal-oxide semiconductor (CMOS) perspective. It offers both a comprehensive explanation of fundamental theories and a broad coverage of MMW integrated circuits and systems.CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems is an excellent reference for faculty, researchers and students working in electrical and electronic engineering, wireless communication, integrated circuit design and circuits and systems. While primarily written for upper-level undergraduate courses, it is also an excellent introduction to the subject for instructors, graduate students, researchers, integrated circuit designers and practicing engineers. Advanced readers could also benefit from this book as it includes many recent state-of-the-art MMW circuits.
Wireless communication is a fundamental need in today's information society. While the total global data traffic grows continuously, the mobile portion increases twice as fast. In addition, even higher data rates are necessary for enabling, e.g., high-definition video streaming or mobile gaming. Both requirements put pressure on the efficiency of wireless communication systems since an increasing data rate and data volume consequently induce a higher power consumption and diminish the battery life of mobile powered devices even further. In this work, innovative solutions for radio frequency front-end transmit and receive monolithic microwave integrated circuits with high data rates and a low power consumption are investigated and developed. Based on insights of this thesis, it is believed that MMIC solutions with requirements on, simultaneously, power consumption and RF performance will play an important role in wireless communication and all sorts of other applications.
Along with numerous opportunities in communication and imaging applications, the design of emerging millimeter-wave (mm-wave) and terahertz (THz) electronic circuits and systems in CMOS technology faces new challenges and requires new devices. Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials provides alternative solutions using CMOS on-chip metamaterials. Unlike conventional metamaterial devices on printed circuit boards (PCBs), the presented CMOS metamaterials can be utilized to build many mm-wave and THz circuits and systems on chip. Leveraging the authors’ extensive expertise and experience with CMOS on-chip metamaterials, this book shows that with the use of metamaterials, one can realize coherent THz signal generation, amplification, transmission, and detection of phase-arrayed CMOS transistors with significantly improved performance. Offering detailed coverage from device to system, the book hereby: Describes integrated circuit design with application of metamaterials in CMOS technology Includes real CMOS integrated circuit examples and chip demonstrations with measurement results Evaluates novel mm-wave and THz communication and imaging systems under CMOS-based system-on-chip integration Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials reflects the latest research progress and provides a state-of-the-art reference on CMOS-based metamaterial devices and mm-wave and THz systems.
A description of field-theoretical methods for the design and analysis of planar waveguide structures and antennas. The principles and limitations of transit-time devices with different injection mechanisms are covered, as are aspects of fabrication and characterization. The physical properties of silicon Schottky contacts and diodes are treated in a separate chapter, while two whole chapters are devoted to silicon/germanium devices. The integration of devices in monolithic circuits is explained together with advanced technologies, such as the self-mixing oscillator operation, before concluding with sensor and system applications.
This book describes the digitally intensive time-domain architectures and techniques applied to millimeter-wave frequency synthesis, with the objective of improving performance and reducing the cost of implementation. Coverage includes system architecture, system level modeling, critical building block design, and digital calibration techniques, making it highly suitable for those who want to learn about mm-wave frequency generation for communication and radar applications, integrated circuit implementation, and time-domain circuit and system techniques. Highlights the challenges of frequency synthesis at mm-wave band using CMOS technology Compares the various approaches for mm-wave frequency generation (pros and cons) Introduces the digitally intensive synthesizer approach and its advantages Discusses the proper partitioning of the digitally intensive mm-wave frequency synthesizer into mm-wave, RF, analog, digital and software components Provides detailed design techniques from system level to circuit level Addresses system modeling, simulation techniques, design-for-test, and layout issues Demonstrates the use of time-domain techniques for high-performance mm-wave frequency synthesis
The exponential growth of demands of simultaneous, multiple, high-speed and high-volume data transfer opens the new era, called 4th Industrial Revolution. A new wave of the fifth generation mobile communication systems (5G) and its ancillary industries such as autonomous vehicle, Internet-of-Things (IoT) and low-latency remote medical monitoring demand unprecedented solutions for both software platform and hardware designs. The requirement of hardware design, especially, is more stringent since the frequency band utilized for 5G will be in millimeter-wave region (~30 GHz), which will be more than >10 times higher than what we have currently employed. The development of mm-wave integrated circuits (ICs), therefore, requires delicate characterization with sophisticated measurement and testing infrastructures. The research projects in this dissertation, in consequence, focus on different integrated mm-wave ICs for various instrumentation circuits and systems. These fully integrated mm-wave ICs were designed with the state-of-the-art performance considering the packaging effects (wirebond or flip-chip packaging) for wideband vector network analyzers (VNAs), signal generators, and modulator/demodulators.
Infrared and Millimeter Waves, Volume 14: Millimeter Components and Techniques, Part V is concerned with millimeter-wave guided propagation and integrated circuits. In addition to millimeter-wave planar integrated circuits and subsystems, this book covers transducer configurations and integrated-circuit techniques, antenna arrays, optoelectronic devices, and tunable gyrotrons. Millimeter-wave gallium arsenide (GaAs) IMPATT diodes are also discussed. This monograph is comprised of six chapters and begins with a description of millimeter-wave integrated-circuit transducers, focusing on various designs and trade-offs and providing hardware examples. The next chapter deals with millimeter-wave planar integrated circuits based on three transmission media: microstrip lines, suspended strip lines, and fin lines. Various transmission media and substrates are first considered, followed by design considerations and performances of several integrated-circuit components, including mixers, IMPATT oscillators, frequency multipliers, switches, filters, couplers, and ferrite devices. A few selected subsystems are also discussed. The following chapters look at planar millimeter-wave antenna arrays; optoelectronic devices for millimeter waves; and the state of the art in GaAs IMPATT diode technology for both cw and pulsed modes of operation. The final chapter is devoted to the gyrotron or electron cyclotron resonance maser. This text will be a useful resource for physicists and electronics and electrical engineers.
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging