The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design. Coverage includes A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. The book’s in-depth application examples provide insight into circuit design and application solutions that you can apply in today’s demanding designs. This is the companion volume to the successful Analog Circuit Design: A Tutorial Guide to Applications and Solutions (October 2011), which has sold over 5000 copies in its the first 6 months of since publication. It extends the Linear Technology collection of application notes, which provides analog experts with a full collection of reference designs and problem solving insights to apply to their own engineering challenges Full support package including online resources (LTSpice) Contents include more application notes on power management, and data conversion and signal conditioning circuit solutions, plus an invaluable circuit collection of reference designs
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Robust and Cost Effective Design for High Speed Digital Products
Author: Larry D. Smith
Publisher: Prentice Hall
Category: Technology & Engineering
Consistently Design PDNs That Deliver Reliable Performance at the Right Cost Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries. Coverage includes • A practical, start-to-finish approach to consistently meeting PDN performance goals • Understanding how signals interact with interconnects • Identifying root causes of common problems, so you can avoid them • Leveraging analysis tools to efficiently explore design space and optimize tradeoffs • Analyzing impedance-related properties of series and parallel RLC circuits • Measuring low impedance for components and entire PDN ecologies • Predicting loop inductance from physical design features • Reducing peak impedances from combinations of capacitors • Understanding power and ground plane properties in the PDN interconnect • Taming signal integrity problems when signals change return planes • Reducing peak impedance created by on-die capacitance and package lead inductance • Controlling transient current waveform interactions with PDN features • Simple spreadsheet-based analysis techniques for quickly creating first-pass designs This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
A Guide to the Project Management Body of Knowledge (PMBOK Guide) Fifth Edition reflects the collaboration and knowledge of working project managers and provides the fundamentals of project management as they apply to a wide range of projects. This internationally recognized standard gives project managers the essential tools to practice project management and deliver organizational results. A 10th Knowledge Area has been added; Project Stakeholder Management expands upon the importance of appropriately engaging project stakeholders in key decisions and activities. Project data information and information flow have been redefined to bring greater consistency and be more aligned with the Data, Information, Knowledge and Wisdom (DIKW) model used in the field of Knowledge Management. Four new planning processes have been added: Plan Scope Management, Plan Schedule Management, Plan Cost Management and Plan Stakeholder Management: These were created to reinforce the concept that eac
This book simplifies the complex field of electromagnetic compatibility into easy concepts without the need for complicated math or extensive computational analysis. Learn how to design printed circuit boards and systems quickly with just five easy equations. Electromagnetic compatibility requirements are easily achieved with the author's unique approach by transforming Maxwell's Equations (calculus) into Ohm's Law (algebra) in a visual manner. Everyone, regardless of experience, will benefit from learning a new way of solving complex field problems using an oscilloscope instead of a spectrum analyzer. Signal propagation is based on transmission line theory. If one can visualize losses in a transmission line, it becomes easy to achieve EMC at low cost as well as enhanced signal integrity. Easy to read chapters simplify theoretical concepts for those who never took a electromagnetics course in college, or designers that seek to re-learn and understand electromagnetic theory as it applies to both printed circuit boards and systems presented in a revolutionary manner. This book contains the following chapters: Maxwell Made Simple Inductance Made Simple Transmission Line Theory Made Simple Power Distribution Networks Made Simple Referencing Made Simple (a.k.a. Grounding) Shielding, Gasketing and Filtering Made Simple"